Nexa3D xMOLD Resin
Product Details
Weight: 5.00 lbs
xMOLD is a high-performance dissolvable resin developed for Freeform Injection Molding (FIM).
Material Properties Summary
| Measurement | Value | Unit | Test Method |
|---|---|---|---|
| Ultimate tensile strength | 38 ± 3 | MPa | ASTM D638 |
| Young’s Modulus | 1152 ± 284 | MPa | ASTM D638 |
| Tensile stress at break | 31 ± 2 | MPa | ASTM D638 |
| Hardness (Post-cure) | Shore D | 80 | ASTM D2240 |
| Toughness | 18 ± 4 | MPa | ASTM D638 |
| Thermal conductivity | 0.187 | W/m K | ISO 22007-2 (2015) |
| Dissolvability | Fully dissolvable | Submerged in demolding solvent | |
| Color | Transparent blue | Visual |
